Bhubaneswar: Odisha, entering a decisive new era of industrial and technological transformation, signed Friday an MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region.
The MoU signing ceremony was graced by Union Electronics & IT Minister Aswini Vaishnaw, Odisha Chief Minister Mohan Majhi, and Intel Corporation CEO Lip Bu Tan. Odisha Chief Secretary Ms. Anu Garg and IT Principal Secretary Vishal Dev were also present.
Odisha Chief Minister Mohan Majhi said, “This is a landmark step towards strengthening India’s semiconductor ecosystem and positioning Odisha as a hub for next-generation technology manufacturing. This transformative investment will create high-skilled employment opportunities for our youth, attract ancillary industries and accelerate Odisha’s transition from traditional industries to advanced manufacturing, innovation and knowledge-driven growth.
